One of the key challenges faced by electronic design teams today is the accurate simulation of complex systems, including high-speed PCBs, ICs, and advanced 3D packaging, where factors like EMI/EMC, signal integrity, and thermal management play a crucial role. Ansys Electronics Simulation tools, such as HFSS, SIwave, and Icepak, provide cutting-edge solutions for addressing these challenges, enabling faster, more efficient design cycles and optimized product performance.
15th October, 2024
10:00AM – 4:00PM
Tower, 1st Floor Tower, IGL, 2, 2B, Dist, subarea,
Sector 126, Noida, Uttar Pradesh 201304
Reach out today and explore how we can assist you in Enabling Innovation
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