This webinar aims to provide participants with an in-depth understanding of how ANSYS Icepak can be used to address and solve thermal management challenges in electronic systems, ensuring optimal performance and reliability.
Welcome and Introduction
Understanding Thermal Challenges
Overview of ANSYS Icepak
Applications of Icepak
Live Demonstration
Q&A Session
Closing Remarks and Follow-Up
Learn the latest techniques for solving thermal management challenges.
Gain practical insights through live demonstrations and real-world case studies.
Intreact with experts to address specific queries and challenges.
4th December, 2024
11:00AM – 12:00PM
Reach out today and explore how we can assist you in Enabling Innovation
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