Electronics Cooling & PCB Thermal Simulation and Analysis

Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).

• Unstructured, Body-fitted Meshing
• Comprehensive Thermal Reliability Solution
• High-fidelity CFD Solver
• Industry Leading Multiscale Multiphysics

Product Specs

Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.

• MCAD and ECAD Support
• Solar radiation
• Parametric and Optimization
• Customization and Automation
• Network Modelling
• DC Joule Heating Analysis
• Electro-thermal and Thermo-Mechanical
• Extensive Libraries for Thermal
• Liquid Cooling
• Dynamic Thermal Management
• Varying Flow and Power ROM